Country for PR: China
Contributor: PR Newswire Asia (China)
Tuesday, March 10 2020 - 20:26
AsiaNet
Hengtong Rockley Reveals 400G DR4 Silicon Photonics Optical Transceiver Module
SUZHOU, China, March 10, 2020 /PRNewswire-AsiaNet/ --

Hengtong Rockley Technology Co., Ltd. announces the release of a 400G QSFP-DD 
DR4 optical module based on Silicon Photonics technology for the 
next-generation data center network. Hengtong Rockley will have a live demo 
from March 10th to March 12th, 2020 at the OFC exhibition in San Diego, CA, 
USA. The new 400G QSFP-DD module is the first 400G Silicon Photonics optical 
module product revealed by Hengtong Rockley. The DR4 optical module will be 
used in next generation Cloud-scale datacenter networks for the connection 
between switches as a low-cost, low-power consumption optical connection 
solution. The deployment of 400G transceivers enables datacenter networks to 
deliver a 4x increase in network speed compared to existing deployments using 
100G.

Hengtong Rockley's 400G QSFP-DD DR4 module uses the industry's most advanced 
7nm DSP chip. The optical chipsets, that form the key building blocks of the 
transceiver, are from Rockley Photonics, Ltd., which will also live-demo their 
Silicon Photonics TX and RX PIC chipsets used in the Hengtong Rockley 400G DR4 
transceiver in their booth at OFC. Rockley's Silicon Photonics technology not 
only integrates the passive and active optical components, to greatly reduce 
the need for optical sub-assembly, but also introduces a special design to ease 
fiber coupling. As a result of the automated passive alignment process for 
light sources and fiber arrays, the manufacturing process for the optical 
module has been simplified and made suitable for mass production. 

Hengtong Rockley Technology Co., Ltd. is a joint venture established by 
Hengtong Optic-Electric Co., Ltd., China and Rockley Photonics Limited, UK. 
Hengtong Rockley designs and manufactures high-end optical modules. It is also 
committed to the design of Silicon Photonic chips and their integration, 
packaging, and testing, for improved competitiveness of optical module design 
and manufacturing.

Source: Hengtong Rockley Technology Co., Ltd.
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