Strong demand for advanced technology drives growth (Q2 2020 Financial 
Highlights):

-Revenue was RMB 6.27 billion, a record high in the second quarter. On a 
comparable basis, taking into account the accounting change in revenue 
recognition, it was an increase of 55.3% year on year (see note). 
-Generated RMB 1.00 billion cash from operations, up 54.9% year on year. With 
net capex investments of RMB 0.64 billion, free cash flow for the quarter was 
RMB 0.36 billion. 
-Net profit was RMB 0.23 billion, a record high second quarter in the past five 
years. 
-Earnings per share was RMB 0.15, as compared to RMB -0.13 in Q2 2019. 

Note: During the reporting period, we optimized the business model for the 
purchase and sale of certain packaged products, of which JCET Group no longer 
bears the general inventory risk on the main raw materials. In accordance with 
PRC GAAP, both revenue and costs of goods sold were recorded on the net basis 
and decreased by RMB 0.93 billion respectively. This change had no impact on 
the company's net profit. Assuming that revenue was still recognized by the 
gross method (should be recorded on the net basis according to PRC GAAP), it 
would be RMB 7.20 billion, an increase of 55.3% over the same period last year.

Global leading semiconductor microsystem integration packaging and test 
provider, JCET Group (SH: 600584) reported financial results for the second 
quarter 2020, ended June 30th, 2020. Revenue was RMB 6.27 billion and net 
profit was RMB 0.23 billion, both a record second quarter high in the past five 
years. These results show that JCET's investment in the development of advanced 
packaging and test technologies has begun to bear fruit.

Mr. Li Zheng, Chief Executive Officer of JCET Group, said, "Following our 
strong Q1 with this Q2 performance shows that JCET is benefiting from the 
strengths of our three global manufacturing hubs, and the continuous 
improvement of our operational excellence. The rapid development of the 5G 
communications industry and high-performance computing applications has 
increased the demand for advanced packaging technologies and manufacturing 
processes. JCET Group's global supply chain resources and strong portfolio of 
advanced technology combined with our world-class management team will continue 
to provide our global customers with industry-leading semiconductor packaging, 
test and design services."

Ms. Janet Chou, Chief Financial Officer of JCET Group, said, "JCET delivered 
solid second quarter results with improvement in key financial metrics. Our 
performance demonstrated our commitment to drive profitable growth and cash 
generation."

About JCET Group: 

JCET Group is a leading global semiconductor system integration packaging and 
test provider, offering a full range of turnkey services that include 
semiconductor package integration design and characterization, R&D, wafer 
probe, wafer bumping, package assembly, final test and drop shipment to vendors 
around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor 
applications such as mobile, communication, compute, consumer, automotive and 
industry etc., through advanced wafer level packaging, 2.5D/3D, 
System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET 
Group has two R&D centers in China and Korea, six manufacturing locations in 
China, Korea and Singapore, and sales centers around the world, providing close 
technology collaboration and efficient supply-chain manufacturing to customers 
in China and around the world.

SOURCE: JCET Group