Today, JCET Group (SSE: 600584), a leading global provider of integrated 
circuit (IC) manufacturing and technology services, announced unaudited 
preliminary net profit results for 2021.

From January 1, 2021 to December 31, 2021, net profit attributable to 
shareholders will be RMB 2.80 billion to RMB 3.08 billion, an increase of RMB 
1.496 billion to RMB 1.776 billion and 114.72% to 136.20% as compared with the 
same period of the previous year. The net profit attributable to shareholders 
excluding non-recurring gains and losses is approximately RMB 2.35 billion to 
RMB 2.58 billion, an increase of RMB 1.398 billion to 1.628 billion and 146.85% 
to 171.01% as compared with the same period of the previous year. These 
preliminary results are estimated based on the company's operating conditions 
and has not yet been audited by a certified public accountant.

JCET's operational efficiency has improved continuously, driven primarily by a 
focus on high value-added business, fast growth market application areas, 
integration and upgrade of global resources. The company enhanced synergies 
among all subsidiaries for technological development and production capacity 
layout. This helped us to better fulfill customer requirements and market 
demand. The company also established a systematic high performance management 
system for sustainable growth. At the same time, customer demand from both 
domestic and international customers remained strong. All manufacturing units 
focused continuously on optimizing product portfolio and controlling costs and 
operating expenses, which drove higher profitability for the year.

About JCET Group

JCET Group is the world's leading integrated-circuit manufacturing and 
technology services provider, offering a full range of turnkey services that 
include semiconductor package integration design and characterization, R&D, 
wafer probe, wafer bumping, package assembly, final test and drop shipment to 
vendors around the world. 

Our comprehensive portfolio covers a wide spectrum of semiconductor 
applications such as mobile, communication, compute, consumer, automotive and 
industry etc., through advanced wafer level packaging, 2.5D/3D, 
System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET 
Group has two R&D centers in China and Korea, six manufacturing locations in 
China, Korea and Singapore, and sales centers around the world, providing close 
technology collaboration and efficient supply-chain manufacturing to customers 
in China and around the world.

SOURCE JCET Group